DocumentCode :
141165
Title :
Very long-term ECG monitoring patch with improved functionality and wearability
Author :
Martinez-Tabares, F.J. ; Gaviria-Gomez, N. ; Castellanos-Dominguez, German
Author_Institution :
Signal Process. & Recognition Group, Univ. Nac. de Colombia, Manizales, Colombia
fYear :
2014
fDate :
26-30 Aug. 2014
Firstpage :
5964
Lastpage :
5967
Abstract :
Heart activity monitoring is an important task for prevention and treatment of cardiovascular diseases. However, development of long-term, wearable electrodes remains an open issue. In fact, adhesion ability and energy consumption while preserving aesthetics is one of the major concerns to implement a minimally invasive monitoring system that measures and transmits electrocardiographic signals (ECG) during long-term periods of time. Based on the concepts of functionality, wearability, and resources, we develop a new long-term ECG monitoring system under the wear-and-forget principle. We also propose a system model of the electrode-skin interface that performs real-time measurements with a minimally invasive effect when compared with another competitive and implantable systems. As a result, testing of designed prototype shows that the developed very long-term ECG monitoring patch improves energy consumption and adhesion time up to 40 days.
Keywords :
biomedical measurement; diseases; electrocardiography; patient monitoring; patient treatment; ECG monitoring patch; ECG signals; adhesion ability; cardiovascular disease prevention; cardiovascular disease treatment; electrocardiographic signals; electrode-skin interface; energy consumption; heart activity monitoring; implantable systems; improved functionality; minimally invasive monitoring system; wear-and-forget principle; wearability; wearable electrodes; Adhesives; Biomedical monitoring; Electrocardiography; Electrodes; Impedance; Monitoring; Skin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2014.6944987
Filename :
6944987
Link To Document :
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