Power Noise Suppression Using Power-and-Ground Via Pairs in Multilayered Printed Circuit Boards

Author

Zhang, Mu-Shui ; Mao, Jun-Fa ; Long, Yun-Liang

Author_Institution

Dept. of Electron. & Commun. Eng., Sun Yat-Sen Univ., Guangzhou, China

Volume

1

Issue

3

fYear

2011

fDate

3/1/2011 12:00:00 AM

Firstpage

374

Lastpage

385

Abstract

In this paper, an efficient power noise suppression method using power-and-ground (PG) via pair array in multilayered printed circuit boards (PCBs) is proposed. The power noise suppression performance is doubled by using both power and ground vias compared with the ground via array. The stopband bandwidth of the PG via pair array is derived. The evolvement from mushroom electromagnetic bandgap (EBG) structure to PG via pair array is demonstrated. The proposed method has overcome many shortcomings of the mushroom EBG structures. It is shown that the PG via pair array has excellent power noise suppression, signal integrity (SI), and electromagnetic compatibility (EMC) performance. It is a comprehensive power noise suppression scheme.

Keywords

earthing; electromagnetic compatibility; photonic band gap; printed circuits; electromagnetic compatibility performance; multilayered printed circuit board; mushroom electromagnetic bandgap structure; power delivery network; power noise suppression method; power-and-ground via pair array; signal integrity; stopband bandwidth; Arrays; Couplings; Dielectrics; Impedance; Metamaterials; Noise; Periodic structures; Power delivery network (PDN); power noise suppression; printed circuit board (PCB);

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2010.2099930

Filename

5674117