• DocumentCode
    1411865
  • Title

    Accurate Characterization of Broadband Multiconductor Transmission Lines for High-Speed Digital Systems

  • Author

    Kim, Joong-Ho ; Oh, Dan ; Kim, Woopoung

  • Author_Institution
    Signal Integrity Eng., Rambus Inc., Los Altos, CA, USA
  • Volume
    33
  • Issue
    4
  • fYear
    2010
  • Firstpage
    857
  • Lastpage
    867
  • Abstract
    Accurate modeling of transmission lines becomes increasingly important in high-speed interconnect system design. However, it is rather difficult to obtain broadband transmission line models, in particular using frequency-domain measurements. This paper points out two potential accuracy issues. First, inaccurate DC values of the frequency-domain data cause a severe error in the time-domain simulations. Second, it is difficult to characterize the characteristic impedance over a wide frequency range due to the reflection caused by the port discontinuities. This paper proposes the combination of both time and frequency measurement data to mitigate the DC accuracy issue. For the characteristic impedance model, a new de-embedding technique is presented to mitigate the port discontinuity issue. Several numerical examples, such as MCM-L coplanar lines and package microstrip lines, are studied to validate the accuracy of the proposed method.
  • Keywords
    coplanar transmission lines; electric impedance; frequency-domain analysis; microstrip lines; multiconductor transmission lines; DC value; MCM-L coplanar lines; broadband multiconductor transmission line; characteristic impedance model; deembedding technique; frequency-domain measurement; high-speed digital system; high-speed interconnect system design; package microstrip lines; Broadband communication; Interconnected systems; Transmission lines; DC transmission line parameters; de-embedding technique for multiconductor transmission lines; generalized conversion formula from ${rm S}$-parameter to RLGC; vector network analyzer (VNA) and time-domain reflectometry (TDR) measurements;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2010.2050204
  • Filename
    5674143