Title :
InGaAsP thin-film microdisk resonators fabricated by polymer wafer bonding for wavelength add-drop filters
Author :
Yong Ma ; Gilbert Chang ; Seoijin Park ; Liwei Wang ; Seng Tiong Ho
Author_Institution :
Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA
Abstract :
10-μm-diameter InGaAsP thin-film microdisk resonators have been fabricated using polymer-wafer bonding with benzocylobutene. This wafer bonding process is to provide strong two-dimensional mode confinement in the waveguide and reduce the optical propagation loss. The measured resonance linewidth at wavelength 1.55 μm is about 0.22 nm with a free-spectral range of 20 nm. The narrow linewidth and large free-spectral range make these devices conducive to the applications in dense wavelength division multiplexed systems.
Keywords :
III-V semiconductors; electron beam lithography; gallium arsenide; gallium compounds; indium compounds; micro-optics; optical communication equipment; optical couplers; optical fabrication; optical films; optical losses; optical resonators; optical waveguide filters; plasma CVD; ridge waveguides; sputter etching; wafer bonding; wavelength division multiplexing; 1.55 mum; 10 mum; InGaAsP; InGaAsP thin-film microdisk resonators; benzocylobutene; dense wavelength division multiplexed systems; free-spectral range; large free-spectral range; narrow linewidth; optical propagation loss; polymer wafer bonding; resonance linewidth; thin-film microdisk resonators; two-dimensional mode confinement; wafer bonding process; waveguide; wavelength; wavelength add-drop filters; Optical filters; Optical losses; Optical propagation; Optical resonators; Optical waveguides; Polymer films; Propagation losses; Resonator filters; Wafer bonding; Wavelength measurement;
Journal_Title :
Photonics Technology Letters, IEEE
