Title :
A 12-channel multimode fiber-optic 1.0625-Gb/s fiber channel receiver based on COTS devices and MCM-L/COB/BGA packaging
Author :
Chan, Eric Y. ; Le, Quynhgiao N. ; Bernak, M.W. ; Huang, Yuing ; Koshinz, Dennis G. ; Hager, Harold E.
Author_Institution :
Boeing Co., Seattle, WA, USA
Abstract :
We describe a high-performance, 12-channel multimode fiber-optic receiver array using a combined multichip module laminate (MCM-L), chip-on-board (COB), and ball grid array (BGA) packaging technology. The array operates at a minimum speed of 1.0625 Gb/s per channel with good channel-to-channel uniformity. Each channel has sensitivity better than /spl sim/18 dSm and dynamic range better than 12 dB. Other important characteristics are good uniformity in rise time, fall time, and peak-to-peak output voltage amplitude across all the channels. The results demonstrate this OE receiver array packaging approach is applicable for a wide variety of platforms that have very stringent requirements in high packaging density, high performance, and low cost.
Keywords :
ball grid arrays; chip-on-board packaging; integrated optoelectronics; multichip modules; optical arrays; optical receivers; sensitivity; telecommunication channels; 1.0625 Gbit/s; 12-channel multimode fiber-optic channel receiver; COTS devices; MCM-L/COB/BGA packaging; OE receiver array packaging; ball grid array; channel-to-channel uniformity; chip-on-board; high packaging density; high performance; high-performance 12-channel multimode fiber-optic receiver array; low cost; minimum speed; multichip module laminate; packaging technology; peak-to-peak output voltage amplitude; sensitivity; Aerospace electronics; Application specific integrated circuits; Costs; Detectors; Multichip modules; Optical arrays; Optical fiber devices; Packaging; Sensor arrays; Silicon;
Journal_Title :
Photonics Technology Letters, IEEE
