DocumentCode :
1412424
Title :
GMR in DC magnetron sputtered Ni81Fe19/Cu multilayers
Author :
Mao, M. ; Cerjan, C. ; Gibbons, M. ; Law, B. ; Grabner, F. ; Vernon, S.P. ; Wall, M.
Author_Institution :
Lawrence Livermore Nat. Lab., CA, USA
Volume :
34
Issue :
4
fYear :
1998
fDate :
7/1/1998 12:00:00 AM
Firstpage :
915
Lastpage :
917
Abstract :
In this paper, we present results of a study on Ni81Fe 19Cu MLs deposited using a four-source DC magnetron sputtering system operated in planetary mode. A significant change of GMR value with deposition conditions, especially base pressure and deposition pressure, has been observed for Ni18Fe19/Cu MLs. With an optimized process, we have obtained a GMR response of 9.5% with a field sensitivity of 0.44%/Oe for Si/[(Ni81Fe19)17 Å/Cu20 Å]20 MLs without an Fe buffer layer. The insertion of a very thin layer of a second magnetic species at nonmagnetic/magnetic interfaces in the ML stack makes GMR response either sensitive or less sensitive to deposition conditions depending on the species selected. We believe that the key to obtaining large GMR values in Ni81Fe 19/Cu MLs lies in the control of layered structure and interfacial chemistry. In addition, these Ni81Fe19/Cu MLs survive high temperature annealing up to 250°C, retaining a GMR value of 8.5%. The thermal stability exhibited by these MLs over the temperature range for device fabrication makes them valuable for high density recording head sensor applications
Keywords :
copper; ferromagnetic materials; giant magnetoresistance; iron alloys; magnetic multilayers; nickel alloys; sputtered coatings; 250 C; DC magnetron sputtered Ni81Fe19/Cu multilayers; Ni81Fe19-Cu; giant magnetoresistance; high density recording head sensor applications; interfacial chemistry; layered structure; Annealing; Buffer layers; Chemistry; Iron; Magnetosphere; Multilevel systems; Sputtering; Temperature distribution; Temperature sensors; Thermal stability;
fLanguage :
English
Journal_Title :
Magnetics, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9464
Type :
jour
DOI :
10.1109/20.706310
Filename :
706310
Link To Document :
بازگشت