Title :
Packaging-compatible microinductors and microtransformers with screen-printed ferrite using low temperature processes
Author :
Park, Jae Y. ; Allen, Mark G.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
7/1/1998 12:00:00 AM
Abstract :
Fully integrated microinductors and microtransformers compatible with organic (low-temperature) electronic packaging are investigated for miniaturized power converters, filters, multichip modules (MCMs), and other consumer electronic products. Four differing geometries of ferrite-based integrated magnetic components have been designed, fabricated, and tested: sandwich-spiral, sandwich-meander, two layer vertically stacked spiral, and bar type (open and closed magnetic circuit). In the comparison of fabricated microinductors, two layers vertically stacked spiral inductors with 50 pm height has the largest inductance (15 μH/cm2 at 10 MHz) and dc resistance (2.1 ohms). The smallest inductance (1.2 μH/cm2 at 1 MHz) and dc resistance (0.35 ohms) are achieved in the fabricated bar type microinductor with a closed magnetic core. In the comparison of fabricated microtransformers, the EMI shielded sandwich type spiral transformer has the best gain characteristics and the lowest resonant frequency (27 MHz), the EMI shielded sandwich-meander-type transformer has the worst gain characteristics, and the closed bar type transformer has the highest resonant frequency (38 MHz)
Keywords :
electromagnetic interference; ferrite devices; ferrite filters; filled polymers; inductors; magnetic cores; multichip modules; plastic packaging; power convertors; thick film devices; transformer cores; transformers; 0.35 ohm; 1 to 38 MHz; 2.1 ohm; 50 mum; EMI shielded sandwich type spiral transformer; EMI shielded sandwich-meander-type transformer; MCM; NiZnFe2O4; bar type microinductor; bar type open/closed magnetic circuit; closed bar type transformer; closed magnetic core; dc resistance; ferrite-based integrated magnetic components; filters; fully integrated microinductors; gain characteristics; inductance; low temperature processes; microinductors; microtransformers; miniaturized power converters; multichip modules; organic low-temperature electronic packaging; packaging-compatible microinductors; resonant frequency; sandwich-meander; sandwich-spiral; screen-printed ferrite; two layer vertically stacked spiral; Circuit testing; Consumer electronics; Electromagnetic interference; Electronics packaging; Inductance; Magnetic separation; Multichip modules; Power filters; Resonant frequency; Spirals;
Journal_Title :
Magnetics, IEEE Transactions on