DocumentCode :
141399
Title :
Highly wearable galvanic skin response sensor using flexible and conductive polymer foam
Author :
Jeehoon Kim ; Sungjun Kwon ; Sangwon Seo ; Kwangsuk Park
Author_Institution :
Interdiscipl. Program of Bioeng., Seoul Nat. Univ., Seoul, South Korea
fYear :
2014
fDate :
26-30 Aug. 2014
Firstpage :
6631
Lastpage :
6634
Abstract :
Owing to advancements in daily physiological monitoring technology, diverse healthcare applications have emerged recently. The monitoring of skin conductance responses has extensive feasibility to support healthcare applications such as detecting emotion changes. In this study, we proposed a highly wearable and reliable galvanic skin response (GSR) sensor that measures the signals from the back of the user. To enhance its wearability and usability, we employed flexible conductive foam as the sensing material and designed it to be easily attachable to (and detachable from) a wide variety of clothes. We evaluated the sensing reliability of the proposed sensor by comparing its signal with a reference GSR. The average correlation between the two signals was 0.768; this is sufficiently high to validate the feasibility of the proposed sensor for reliable GSR sensing on the back.
Keywords :
bioelectric phenomena; biomedical measurement; body sensor networks; electric sensing devices; electrical conductivity; emotion recognition; health care; patient monitoring; polymer foams; skin; average correlation; conductive polymer foam; daily physiological monitoring technology; emotion change detection; flexible conductive foam; flexible polymer foam; healthcare applications; highly wearable galvanic skin response sensor; reference GSR; reliable GSR sensing; sensing material; sensing reliability; skin conductance response monitoring; usability; wearability; Biomedical monitoring; Correlation; Electrodes; Fingers; Reliability; Sensors; Skin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location :
Chicago, IL
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2014.6945148
Filename :
6945148
Link To Document :
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