Title :
Nonlinear Grounded Metasurfaces for Suppression of High-Power Pulsed RF Currents
Author :
Sievenpiper, Daniel F.
Author_Institution :
Electr. & Comput. Eng. Dept., Univ. of California, La Jolla, CA, USA
fDate :
7/3/1905 12:00:00 AM
Abstract :
High-power radio frequency transmitters can cause interference or damage to sensitive receivers and other electronic equipment. These signals may be coupled into circuitry through currents in the surfaces of metal enclosures, and even a small gap in conductive shielding can represent a vulnerable point of entry. This problem can be mitigated by using a lossy coating or a reactive surface to suppress surface currents. However, this may reduce the performance of other antenna systems or disturb other aspects of the electromagnetic design. Nonlinear metamaterials provide an attractive alternative. By including nonlinear behavior into a periodic structure through embedded electronic circuits, it is possible to construct a coating that provides minimal disturbance to low-power surface currents, but becomes strongly absorbing under high-power RF illumination. In this letter, a nonlinear metamaterial coating is introduced, and we demonstrate its performance as a thin, broadband, absorbing surface for high-power pulsed RF currents.
Keywords :
interference suppression; metamaterial antennas; metamaterials; radio receivers; radio transmitters; antenna systems; conductive shielding; electromagnetic design; electronic circuits; electronic equipment; high-power RF illumination; high-power pulsed RF currents suppression; high-power radio frequency transmitters; low-power surface currents; metal enclosures; nonlinear grounded metasurfaces; nonlinear metamaterial coating; nonlinear metamaterials; periodic structure; receivers; Integrated circuit modeling; Interference suppression; Metamaterials; Nonlinear circuits; Surface impedance; Surface treatment; Surface waves; Interference suppression; metamaterials; nonlinear circuits; surface impedance;
Journal_Title :
Antennas and Wireless Propagation Letters, IEEE
DOI :
10.1109/LAWP.2011.2182593