• DocumentCode
    141486
  • Title

    Estimating surgical needle deflection with printed strain gauges

  • Author

    Hammond, Frank L. ; Smith, M.J. ; Wood, Robert J.

  • Author_Institution
    Sch. of Eng. & Appl. Sci., Harvard Univ., Cambridge, MA, USA
  • fYear
    2014
  • fDate
    26-30 Aug. 2014
  • Firstpage
    6931
  • Lastpage
    6936
  • Abstract
    The ability to track surgical needle deflection during procedures such as therapeutic drug delivery, biopsies, and medical device implantation allows clinicians to minimize positioning errors and procedural complications due to instrument deviations. We describe the use of a novel strain gauge printing method to sensorize surgical needles for the purpose of sensing needle shape and deflection during surgical procedures. The additive vapor-deposition based sensor fabrication method used here is capable of applying strain gauges (and resistive circuit elements) with micron-scale features onto surgical instruments of varying curvature and material composition without the need for mechanical machining. This fabrication method is used to apply several strain gauges onto an 18 gauge core biopsy needle to sense deflections. Validation experiments demonstrate a gauge factor of 1.16 for the printed strain gauges and nominal needle deflection measurement resolution of 500 microns.
  • Keywords
    biomedical equipment; biomedical measurement; needles; strain gauges; additive vapor-deposition method; biopsy needle; medical device implantation; micron-scale features; needle deflection measurement resolution; positioning errors; printed strain gauges; procedural complications; resistive circuit elements; sensor fabrication method; strain gauge printing method; surgical instruments; surgical needle deflection estimation; therapeutic drug delivery; Coatings; Instruments; Needles; Resistance; Sensitivity; Strain; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2014.6945222
  • Filename
    6945222