Title :
Effective allocation of ground vias for MMICs
Author :
Ng, Chi-Keung ; Cheng, Kwok-Keung M.
Author_Institution :
Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
fDate :
8/6/1998 12:00:00 AM
Abstract :
The high frequency behaviour of monolithic microwave integrated circuits (MMICs) is highly affected by the way in which the package is grounded. The authors investigate, by computer simulation and experiments, the effects of poor grounding and optimal allocation of ground vias on the performance of packaged MMICs
Keywords :
MMIC; circuit optimisation; integrated circuit modelling; integrated circuit packaging; MMICs; computer simulation; ground vias; grounding; high frequency behaviour; optimal allocation; package;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19981101
