• DocumentCode
    1415660
  • Title

    Effective allocation of ground vias for MMICs

  • Author

    Ng, Chi-Keung ; Cheng, Kwok-Keung M.

  • Author_Institution
    Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
  • Volume
    34
  • Issue
    16
  • fYear
    1998
  • fDate
    8/6/1998 12:00:00 AM
  • Firstpage
    1594
  • Lastpage
    1595
  • Abstract
    The high frequency behaviour of monolithic microwave integrated circuits (MMICs) is highly affected by the way in which the package is grounded. The authors investigate, by computer simulation and experiments, the effects of poor grounding and optimal allocation of ground vias on the performance of packaged MMICs
  • Keywords
    MMIC; circuit optimisation; integrated circuit modelling; integrated circuit packaging; MMICs; computer simulation; ground vias; grounding; high frequency behaviour; optimal allocation; package;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19981101
  • Filename
    707161
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1415660