DocumentCode
1415919
Title
Electronic part life cycle concepts and obsolescence forecasting
Author
Solomon, Rajeev ; Sandborn, Peter A. ; Pecht, Michael G.
Author_Institution
Nortel Networks, Research Triangle Park, NC, USA
Volume
23
Issue
4
fYear
2000
fDate
12/1/2000 12:00:00 AM
Firstpage
707
Lastpage
717
Abstract
Obsolescence of electronic parts is a major contributor to the life cycle cost of long-field life systems such as avionics. A methodology to forecast life cycles of electronic parts is presented, in which both years to obsolescence and life cycle stages are predicted. The methodology embeds both market and technology factors based on the dynamic assessment of sales data. The predictions enabled from the models developed in this paper allow engineers to effectively manage the introduction and on-going use of long field-life products based on the projected life cycle of the parts incorporated into the products. Application of the methodology to integrated circuits is discussed and obsolescence predictions for dynamic random access memories (DRAMs) are demonstrated. The goal is to significantly reduce design iterations, inventory expenses, sustainment costs, and overall life cycle product costs
Keywords
DRAM chips; avionics; design engineering; economics; electronic equipment manufacture; electronics industry; integrated circuit economics; monolithic integrated circuits; DRAMs; avionics; dynamic RAMs; dynamic assessment; dynamic random access memories; electronic part life cycle concepts; integrated circuits; life cycle cost; long-field life systems; market factors; obsolescence forecasting; obsolescence predictions; projected life cycle; sales data; technology factors; Aerospace electronics; Application specific integrated circuits; Consumer electronics; Costs; DRAM chips; Economic forecasting; Engineering management; Marketing and sales; Predictive models; Project management;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/6144.888857
Filename
888857
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