• DocumentCode
    1415926
  • Title

    Editorial

  • Author

    Pecht, Michael G.

  • Author_Institution
    University of Maryland
  • Volume
    23
  • Issue
    4
  • fYear
    2000
  • Firstpage
    718
  • Lastpage
    718
  • Abstract
    Many of the national and international trade societies have been devoting significant resources to develop roadmaps relevant to their own industry. The goal is to provide information to drive both their industry and to influence other related industry sectors in the supply chain. These roadmaps work by keeping a rolling horizon in sight to stay abreast of current technological developments. In this issue of the open forum, Dr. G. Munie of Lucent Technologies discusses the industry roadmaps and customer expectations in the telecom industry with respect to the future of the PWB industry and the electronic manufacturing services. The Open Forum Editor hopes readers enjoy this article and will be able to use this information the next time he or she is called upon to develop a "roadmap" for their workgroup, company, or the industry.
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2000.888858
  • Filename
    888858