DocumentCode :
1415926
Title :
Editorial
Author :
Pecht, Michael G.
Author_Institution :
University of Maryland
Volume :
23
Issue :
4
fYear :
2000
Firstpage :
718
Lastpage :
718
Abstract :
Many of the national and international trade societies have been devoting significant resources to develop roadmaps relevant to their own industry. The goal is to provide information to drive both their industry and to influence other related industry sectors in the supply chain. These roadmaps work by keeping a rolling horizon in sight to stay abreast of current technological developments. In this issue of the open forum, Dr. G. Munie of Lucent Technologies discusses the industry roadmaps and customer expectations in the telecom industry with respect to the future of the PWB industry and the electronic manufacturing services. The Open Forum Editor hopes readers enjoy this article and will be able to use this information the next time he or she is called upon to develop a "roadmap" for their workgroup, company, or the industry.
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2000.888858
Filename :
888858
Link To Document :
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