DocumentCode
1415926
Title
Editorial
Author
Pecht, Michael G.
Author_Institution
University of Maryland
Volume
23
Issue
4
fYear
2000
Firstpage
718
Lastpage
718
Abstract
Many of the national and international trade societies have been devoting significant resources to develop roadmaps relevant to their own industry. The goal is to provide information to drive both their industry and to influence other related industry sectors in the supply chain. These roadmaps work by keeping a rolling horizon in sight to stay abreast of current technological developments. In this issue of the open forum, Dr. G. Munie of Lucent Technologies discusses the industry roadmaps and customer expectations in the telecom industry with respect to the future of the PWB industry and the electronic manufacturing services. The Open Forum Editor hopes readers enjoy this article and will be able to use this information the next time he or she is called upon to develop a "roadmap" for their workgroup, company, or the industry.
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2000.888858
Filename
888858
Link To Document