• DocumentCode
    1416086
  • Title

    Long-Term Thermal Overstressing of Computers

  • Author

    Gray, Kirk A. ; Pecht, Michael

  • Volume
    28
  • Issue
    6
  • fYear
    2011
  • Firstpage
    58
  • Lastpage
    65
  • Abstract
    Significant opportunities exist to reduce costs in the design, manufacture, and operation of systems by using temperatures higher than specified in testing systems´ reliability. The authors share the findings and observations of an experimental study in which they subjected operating computers to high steady-state temperatures and thermal cycling well beyond their design specifications. The results suggest that significant cost savings can be realized without compromising reliability.
  • Keywords
    DP industry; computer equipment testing; computer testing; cost reduction; design engineering; reliability; thermal stresses; cost reduction; cost savings; design specification; high steady state temperature; system reliability testing; thermal cycling; thermal overstressing; Computers; Cost benefit analysis; Failure analysis; Hardware; Reliability engineering; Temperature measurement; computer; cost savings; design and test; high temperature; long-term thermal overstressing; reliability;
  • fLanguage
    English
  • Journal_Title
    Design & Test of Computers, IEEE
  • Publisher
    ieee
  • ISSN
    0740-7475
  • Type

    jour

  • DOI
    10.1109/MDT.2011.127
  • Filename
    6123681