DocumentCode
1416086
Title
Long-Term Thermal Overstressing of Computers
Author
Gray, Kirk A. ; Pecht, Michael
Volume
28
Issue
6
fYear
2011
Firstpage
58
Lastpage
65
Abstract
Significant opportunities exist to reduce costs in the design, manufacture, and operation of systems by using temperatures higher than specified in testing systems´ reliability. The authors share the findings and observations of an experimental study in which they subjected operating computers to high steady-state temperatures and thermal cycling well beyond their design specifications. The results suggest that significant cost savings can be realized without compromising reliability.
Keywords
DP industry; computer equipment testing; computer testing; cost reduction; design engineering; reliability; thermal stresses; cost reduction; cost savings; design specification; high steady state temperature; system reliability testing; thermal cycling; thermal overstressing; Computers; Cost benefit analysis; Failure analysis; Hardware; Reliability engineering; Temperature measurement; computer; cost savings; design and test; high temperature; long-term thermal overstressing; reliability;
fLanguage
English
Journal_Title
Design & Test of Computers, IEEE
Publisher
ieee
ISSN
0740-7475
Type
jour
DOI
10.1109/MDT.2011.127
Filename
6123681
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