• DocumentCode
    1416462
  • Title

    Packaging of Dual-Mode Wireless Communication Module Using RF/Optoelectronic Devices With Shared Functional Components

  • Author

    Liao, Jun ; Zeng, Juan ; Deng, Shengling ; Boryssenko, Anatoliy O. ; Joyner, Valencia M. ; Huang, Zhaoran Rena

  • Author_Institution
    Dept. of Electr., Comput., & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
  • Volume
    33
  • Issue
    2
  • fYear
    2010
  • fDate
    5/1/2010 12:00:00 AM
  • Firstpage
    323
  • Lastpage
    332
  • Abstract
    This paper reports the design, fabrication, and testing of a compact radio-frequency (RF)/ free space optical (FSO) dual mode wireless communication system. A modified split dual-director quasi-Yagi antenna is integrated with optical transmitter and receiver by sharing layout structural components. Bare die vertical-cavity surface-emitting laser (VCSEL) and P-i-N photodiode (PIN) are placed on antenna director pads and wire bonded to printed circuit board (PCB)-mounted laser driver and transimpedance amplifier (TIA) circuits. Detailed analysis of coupling between RF channel and associated electrical connections for the FSO channel is presented using commercial simulation tools to predict its impact on link degradation. Although crosstalk appears between RF and optical channels, the prototyped system demonstrated dual-mode high-rate communication capability with measured 2.5 Gb/s data rate in FSO link. Variations in RF subsystem features due to coupling from the FSO subsystem is estimated through radiation pattern measurement using near-field scanner.
  • Keywords
    Yagi antenna arrays; antenna radiation patterns; operational amplifiers; optical communication; optoelectronic devices; p-i-n diodes; printed circuits; surface emitting lasers; P-i-N photodiode; RF devices; antenna director pads; die vertical-cavity surface-emitting laser; free space optical dual mode wireless communication system; optical receiver; optical transmitter; optoelectronic devices; printed circuit board-mounted laser driver; radiation pattern measurement; simulation tools; split dual-director quasi-Yagi antenna; transimpedance amplifier circuits; Dual mode communication; free space optics; hybrid packaging; quasi-Yagi antenna; signal integrity;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2009.2038359
  • Filename
    5411940