Reliability of liquid crystal polymer air cavity packaging

We present the development of liquid crystal polymer (LCP) packages and thermal compression sealing processes. We demonstrate the complete process for prototyping, sealing, and assembling a single-chip LCP package at microwave frequencies. Using the thermal compression technique, we achieve a measured fine leak rate of 3.7×10^-8 cc-atm/s of a LCP package cavity. We have conducted a series of environmental tests such as temperature cycling and 85°C and 85% humidity. We demonstrated that LCP packages have passed major environmental tests and proved to be a reliable package platform.