• DocumentCode
    1417118
  • Title

    An Effective Correction Methodology for Interference of Stress-Induced Leakage Current in TDDB Evaluation of High- k Dielectrics

  • Author

    Wu, Ernest Y.

  • Author_Institution
    Microelectron. Div., Semicond. R&D Center, IBM, Essex Junction, VT, USA
  • Volume
    33
  • Issue
    2
  • fYear
    2012
  • Firstpage
    191
  • Lastpage
    193
  • Abstract
    A simple and effective correction methodology for interference of stress-induced leakage current (SILC) in time-dependent-dielectric-breakdown (TDDB) evaluation of high-k dielectrics is reported. Unlike the violation of weakest link failure property found in conventional TDDB evaluation with SILC interference, we have demonstrated that time-to-failure distributions obtained with this new methodology restores this universal property. Excellent results in terms of improved time to failure and Weibull slope were obtained, thus providing a realistic TDDB projection. The algorithm of this methodology is easy to implement and can be used in daily TDDB evaluation.
  • Keywords
    dielectric materials; electric breakdown; leakage currents; TDDB evaluation; Weibull slope; effective correction methodology; high-k dielectrics; stress-induced leakage current; time-dependent-dielectric-breakdown evaluation; time-to-failure distribution; Current measurement; Dielectrics; High K dielectric materials; Leakage current; Logic gates; Stress; Transient analysis; Breakdown; high-$k$ reliability; stress-induced leakage current (SILC); time-dependent dielectric breakdown (TDDB);
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2011.2177957
  • Filename
    6125978