• DocumentCode
    1418266
  • Title

    A new thermal unit commitment approach using constraint logic programming

  • Author

    Huang, Kun-Yuan ; Yang, Hong-Tzer ; Huang, Ching-Lien

  • Author_Institution
    Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
  • Volume
    13
  • Issue
    3
  • fYear
    1998
  • fDate
    8/1/1998 12:00:00 AM
  • Firstpage
    936
  • Lastpage
    945
  • Abstract
    The authors propose a constraint logic programming (CLP) algorithm to solve the thermal unit commitment (UC) problem in this paper. The algorithm combines the characteristics of the logic programming with the constraint satisfaction as well as the depth-first branch and bound search techniques to provide an efficient and flexible approach to the UC problem. Through the constraint satisfaction techniques, the constraints, which consist of the upper bound on the objective value, are propagated as much as possible to actively reduce the search space of the UC problem in a priori way. Consequently, the optimal solution can be acquired in a very early stage. To demonstrate the effectiveness of the proposed approach, the practical thermal UC problem of Taiwan Power (Taipower) 38-unit system over a 24-hour period is solved by the CLP algorithm implemented in CHIP language. The results obtained are compared with those from the established methods of the dynamic programming, the Lagrangian relaxation as well as the simulated annealing
  • Keywords
    load dispatching; load distribution; logic programming; power system planning; thermal power stations; CHIP language; Taiwan; algorithm; constraint logic programming; constraint satisfaction techniques; depth-first branch and bound search techniques; thermal unit commitment approach; Artificial intelligence; Control systems; IEEE members; Load forecasting; Logic programming; Power generation; Power system simulation; Power systems; Thermal engineering; Upper bound;
  • fLanguage
    English
  • Journal_Title
    Power Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-8950
  • Type

    jour

  • DOI
    10.1109/59.708832
  • Filename
    708832