Title :
3-D FEM/BEM-hybrid modeling of surface mounted devices within planar circuits
Author :
Eibert, T.F. ; Hansen, V.
Author_Institution :
Radiation Lab., Michigan Univ., Ann Arbor, MI, USA
fDate :
9/1/1998 12:00:00 AM
Abstract :
Three-dimensional (3-D) finite-element (FE) meshes of surface-mounted devices (SMDs) are combined with the surface-current models of planar circuits in multilayered media. This is accomplished on the basis of Huygens´ principle via the introduction of equivalent electric and magnetic surface-current densities on a surface enclosing the 3-D parts of the SMDs. The fields in the layered media are described by a surface integral equation based on the dyadic Green´s function of the layered media. Special attention is directed to a proper interface of the surface and 3-D parts of the models. Numerical results for a homogeneous and a multilayered capacitor in a microstrip circuit are presented
Keywords :
Green´s function methods; boundary-elements methods; capacitors; electromagnetic field theory; finite element analysis; integral equations; microstrip circuits; modelling; surface mount technology; 3D FEM/BEM-hybrid modeling; 3D finite-element meshes; Huygens principle; SMD; dyadic Green function; electric surface-current densities; homogeneous capacitor; magnetic surface-current densities; microstrip circuit; multilayered capacitor; multilayered media; planar circuits; surface integral equation; surface mounted devices; surface-current models; Capacitors; Circuits; Finite element methods; Integral equations; Iron; Laboratories; Metallization; Microstrip; Nonhomogeneous media; Numerical models;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
