Title :
Contributed papers
Abstract :
The following topics are dealt with: NAND flash memory; DRAM; CMOS integrated circuits; sensors; BGA solder joints; lithography; and electronics packaging.
Keywords :
CMOS integrated circuits; NAND circuits; ball grid arrays; electronics packaging; flash memories; photolithography; sensors; solders; BGA solder joints; CMOS integrated circuits; DRAM; NAND flash memory; electronics packaging; lithography; sensors;
Conference_Titel :
Microelectronics And Electron Devices (WMED), 2014 IEEE Workshop On
Conference_Location :
Boise, ID
Print_ISBN :
978-1-4799-2222-2
DOI :
10.1109/WMED.2014.6818705
