DocumentCode
141951
Title
Invited talk: CMOS device scaling — Past, present, and future
Author
Yuan Taur
Author_Institution
Univ. of California, San Diego, La Jolla, CA, USA
fYear
2014
fDate
18-18 April 2014
Firstpage
1
Lastpage
1
Abstract
CMOS technology ushered in the silicon VLSI era over thirty years ago. This talk reviews the history of CMOS devices and projects their future prospects. For any given technology node, CMOS performance is limited by the shortest channel length that can be made while maintaining the integrity of transistor action. The development of the MOSFET scale length theory will be tracked from the 1970s to the present, as it evolves from the one-region model for bulk MOSFETs, to the two-region model for dealing with thick, high-k gate dielectrics, then to the three-region model for multiple-gate MOSFETs such as FinFETs. It gives powerful guidelines that, along with quantum mechanical considerations, allow the projection of scaling limits for bulk, SOI, double-gate, and nanowire MOSFETs.
Keywords
CMOS integrated circuits; MOSFET; high-k dielectric thin films; CMOS devices; CMOS performance; CMOS technology; FinFET; MOSFET scale length theory; bulk MOSFET; channel length; high-k gate dielectrics; multiple-gate MOSFET; one-region model; quantum mechanical considerations; scaling limits; silicon VLSI era; three-region model; transistor action integrity; two-region model; Biological system modeling; CMOS integrated circuits; CMOS technology; Educational institutions; MOSFET; Semiconductor device modeling; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics And Electron Devices (WMED), 2014 IEEE Workshop On
Conference_Location
Boise, ID
ISSN
1947-3834
Print_ISBN
978-1-4799-2222-2
Type
conf
DOI
10.1109/WMED.2014.6818711
Filename
6818711
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