• DocumentCode
    1420935
  • Title

    Circuital Modeling and Measurement of Shielding Effectiveness Against Oblique Incident Plane Wave on Apertures in Multiple Sides of Rectangular Enclosure

  • Author

    Shim, Jongjoo ; Kam, Dong Gun ; Kwon, Jong Hwa ; Kim, Joungho

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
  • Volume
    52
  • Issue
    3
  • fYear
    2010
  • Firstpage
    566
  • Lastpage
    577
  • Abstract
    A simple circuital approach to evaluate the shielding effectiveness (SE) of rectangular enclosures with apertures is proposed, considering oblique incidence and polarization. The scope of the proposed model is extended beyond 1 GHz, including higher order modes of the cavity. Furthermore, apertures are not required to be on the front face of the enclosure. In the proposed model, the SE of the enclosure with apertures on multiple sides can be simply calculated by vector decomposition. The proposed model has been successfully verified by using a conventional full-wave simulation tool. We also measured the SE of a manufactured aluminum enclosure with apertures on multiple sides.
  • Keywords
    circuit simulation; electric field measurement; electromagnetic shielding; electromagnetic wave polarisation; rectangular waveguides; aluminum enclosure; aperture; circuital modeling; electromagnetic shielding; electromagnetic wave polarization; full-wave simulation tool; oblique incident plane wave; rectangular enclosure; shielding effectiveness measurement; vector decomposition; Aluminum; Apertures; Circuit simulation; Electromagnetic compatibility; Electronic equipment; Electronic equipment manufacture; Finite difference methods; Polarization; Rectangular waveguides; Tellurium; Time domain analysis; Transmission line matrix methods; Apertures; cavities; circuit modeling; rectangular waveguides; shielding;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2009.2039483
  • Filename
    5416320