DocumentCode :
142115
Title :
Hot topic session 12A: Split manufacturing — IARPA´s TIC program
Author :
Collins, David ; Karri, Ramesh
fYear :
2014
fDate :
13-17 April 2014
Firstpage :
1
Lastpage :
2
Abstract :
State of the art integrated circuit manufacturing is mainly centered in Asia. The US government is concerned about procuring integrated circuits from untrusted sources. In addition to the worries about counterfeiting, there is also a concern about the loss of design information which would reveal the functionality of critical circuits. IARPA´s TIC program is one approach to protecting critical program information and still obtain the performance and power advantages of state of the art circuits.
Keywords :
integrated circuit manufacture; integrated circuit manufacturing; split manufacturing; Abstracts; Fabrication; Foundries; Government; Integrated circuits; Security;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Test Symposium (VTS), 2014 IEEE 32nd
Conference_Location :
Napa, CA
Type :
conf
DOI :
10.1109/VTS.2014.6818801
Filename :
6818801
Link To Document :
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