• DocumentCode
    142115
  • Title

    Hot topic session 12A: Split manufacturing — IARPA´s TIC program

  • Author

    Collins, David ; Karri, Ramesh

  • fYear
    2014
  • fDate
    13-17 April 2014
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    State of the art integrated circuit manufacturing is mainly centered in Asia. The US government is concerned about procuring integrated circuits from untrusted sources. In addition to the worries about counterfeiting, there is also a concern about the loss of design information which would reveal the functionality of critical circuits. IARPA´s TIC program is one approach to protecting critical program information and still obtain the performance and power advantages of state of the art circuits.
  • Keywords
    integrated circuit manufacture; integrated circuit manufacturing; split manufacturing; Abstracts; Fabrication; Foundries; Government; Integrated circuits; Security;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Test Symposium (VTS), 2014 IEEE 32nd
  • Conference_Location
    Napa, CA
  • Type

    conf

  • DOI
    10.1109/VTS.2014.6818801
  • Filename
    6818801
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=142115