• DocumentCode
    1421579
  • Title

    Wideband waveguide to microstrip probe transition with LTCC technology

  • Author

    Wu, Po-Han ; Wang, Zhen ; Zhang, Ye ; Sun, Sen ; Xu, Ruimin

  • Author_Institution
    EHF Key Lab. of Fundamental Sci., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • Volume
    47
  • Issue
    1
  • fYear
    2011
  • Firstpage
    43
  • Lastpage
    44
  • Abstract
    A novel broadband waveguide to microstrip probe transition based on low-temperature co-fired ceramic (LTCC) technology is presented and experimentally verified for the first time. To improve the bandwidth and impedance matching, a multilayer step-shape matching structure beneath the probe is buried in the LTCC substrate, which is implemented by installing conducting ground strips on different substrate layers connected by the staggered via side walls. A waveguide to microstrip probe transition is fabricated to verify the design with compact size. Measured results show good agreement with simulated results.
  • Keywords
    ceramic packaging; impedance matching; microstrip transitions; waveguide transitions; LTCC substrate; LTCC technology; bandwidth matching; broadband waveguide; impedance matching; low temperature co fired ceramic; microstrip probe transition; multilayer step-shape matching structure; wideband waveguide;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el.2010.1956
  • Filename
    5682194