DocumentCode
1421579
Title
Wideband waveguide to microstrip probe transition with LTCC technology
Author
Wu, Po-Han ; Wang, Zhen ; Zhang, Ye ; Sun, Sen ; Xu, Ruimin
Author_Institution
EHF Key Lab. of Fundamental Sci., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Volume
47
Issue
1
fYear
2011
Firstpage
43
Lastpage
44
Abstract
A novel broadband waveguide to microstrip probe transition based on low-temperature co-fired ceramic (LTCC) technology is presented and experimentally verified for the first time. To improve the bandwidth and impedance matching, a multilayer step-shape matching structure beneath the probe is buried in the LTCC substrate, which is implemented by installing conducting ground strips on different substrate layers connected by the staggered via side walls. A waveguide to microstrip probe transition is fabricated to verify the design with compact size. Measured results show good agreement with simulated results.
Keywords
ceramic packaging; impedance matching; microstrip transitions; waveguide transitions; LTCC substrate; LTCC technology; bandwidth matching; broadband waveguide; impedance matching; low temperature co fired ceramic; microstrip probe transition; multilayer step-shape matching structure; wideband waveguide;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el.2010.1956
Filename
5682194
Link To Document