Title :
EMI-noise analysis under ASIC design environment
Author :
Hayashi, Sachio ; Yamada, Masaaki
Author_Institution :
Syst. LSI Design Div., Toshiba Corp., Kawasaki, Japan
fDate :
11/1/2000 12:00:00 AM
Abstract :
Electromagnetic compatibility (EMC) has become more and more important in designing electronic systems. Although electromagnetic radiation itself mainly occurs from off-chip conductors, the ultimate noise source is in LSI chips. Among the noise distribution paths, the power-line conducting noise is the most significant source of electromagnetic interference (EMI)-noise caused by LSIs. This paper introduces an EMI-noise analysis method suitable for application-specific integrated circuit design environment especially focusing on the power-line conducting noise. Modeling method for power network and switching activity, simulation flow, and experimental results are presented. Experimental results show that our modeling methodology estimates capacitance values with sufficient accuracy and reproduces the relative differences in EMI-noise levels
Keywords :
application specific integrated circuits; circuit CAD; circuit simulation; electromagnetic compatibility; electromagnetic interference; integrated circuit design; large scale integration; ASIC design environment; EMI-noise analysis; LSI chips; capacitance values; electromagnetic compatibility; integrated circuit design environment; noise distribution paths; noise source; power-line conducting noise; simulation flow; switching activity; Application specific integrated circuits; Circuit simulation; Conductors; Electromagnetic compatibility; Electromagnetic compatibility and interference; Electromagnetic interference; Electromagnetic radiation; Integrated circuit noise; Large scale integration; Working environment noise;
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on