مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

1421865

Title :

[Back inside cover]

Volume :

Issue :

fYear :

1998

Abstract :

Provides instructions and guidelines to prospective authors who wish to submit manuscripts.

fLanguage :

English

Journal_Title :

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher :

ieee

ISSN :

1070-9894

Type :

jour

DOI :

10.1109/TCPMB.1998.7102335

Filename :

7102335

Link To Document :