• DocumentCode
    1422432
  • Title

    New Route In System Integration: Chip-Package Codesign

  • Author

    Troster, G.

  • Volume
    18
  • Issue
    4
  • fYear
    1998
  • Firstpage
    7
  • Lastpage
    9
  • Keywords
    Conferences; Costs; Electromagnetic interference; Electronics packaging; Energy consumption; Integrated circuit interconnections; Integrated circuit packaging; Manufacturing; Power system interconnection; Routing;
  • fLanguage
    English
  • Journal_Title
    Micro, IEEE
  • Publisher
    ieee
  • ISSN
    0272-1732
  • Type

    jour

  • DOI
    10.1109/MM.1998.710865
  • Filename
    710865
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1422432