DocumentCode :
1422432
Title :
New Route In System Integration: Chip-Package Codesign
Author :
Troster, G.
Volume :
18
Issue :
4
fYear :
1998
Firstpage :
7
Lastpage :
9
Keywords :
Conferences; Costs; Electromagnetic interference; Electronics packaging; Energy consumption; Integrated circuit interconnections; Integrated circuit packaging; Manufacturing; Power system interconnection; Routing;
fLanguage :
English
Journal_Title :
Micro, IEEE
Publisher :
ieee
ISSN :
0272-1732
Type :
jour
DOI :
10.1109/MM.1998.710865
Filename :
710865
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1422432
