Title :
Chip-package codesign for high-frequency circuits and systems
Author_Institution :
AT&T Bell Labs., Murray Hill, NJ, USA
Abstract :
When the need for high frequency combines with the demand for low-cost consumer electronics, the challenge of ensuring correctly functioning components becomes paramount. Focusing on chip-package codesign offers a solution
Keywords :
integrated circuit design; packaging; chip-package codesign; consumer electronics; high frequency; low-cost; Chip scale packaging; Circuits and systems; Electronics industry; Electronics packaging; Frequency; Inductance; Integrated circuit packaging; Integrated circuit technology; Pins; Semiconductor device packaging;
Journal_Title :
Micro, IEEE
