• DocumentCode
    1422457
  • Title

    Large chip vs. MCM for a high-performance system

  • Author

    Davidson, Evan E.

  • Author_Institution
    IBM Corp., Poughkeepsie, NY, USA
  • Volume
    18
  • Issue
    4
  • fYear
    1998
  • Firstpage
    33
  • Lastpage
    41
  • Abstract
    The capabilities of modern semiconductor processes enable us to design a system on a chip. This implies a large function on a large chip. However, as we approach-and eventually exceed-a 1-GHz clock rate, it is valid to ask whether partitioning this chip into a few smaller chips and using a multichip module (MCM) to interconnect the functions is better for performance and cost. This article explores the design, performance, and cost issues for a large chip and an MCM, focusing primarily on the on-chip and off-chip delays and the trade-offs between the two. It also shows performance trends for each approach, to help us understand future performance limits for microprocessors
  • Keywords
    microprocessor chips; multichip modules; semiconductor technology; cost; delays; large chip; microprocessors; multichip module; performance; performance trends; semiconductor processes; Bandwidth; Copper; Costs; Delay effects; Electronics packaging; FETs; Frequency; Integrated circuit interconnections; Microprocessors; Temperature;
  • fLanguage
    English
  • Journal_Title
    Micro, IEEE
  • Publisher
    ieee
  • ISSN
    0272-1732
  • Type

    jour

  • DOI
    10.1109/40.710869
  • Filename
    710869