DocumentCode
1422457
Title
Large chip vs. MCM for a high-performance system
Author
Davidson, Evan E.
Author_Institution
IBM Corp., Poughkeepsie, NY, USA
Volume
18
Issue
4
fYear
1998
Firstpage
33
Lastpage
41
Abstract
The capabilities of modern semiconductor processes enable us to design a system on a chip. This implies a large function on a large chip. However, as we approach-and eventually exceed-a 1-GHz clock rate, it is valid to ask whether partitioning this chip into a few smaller chips and using a multichip module (MCM) to interconnect the functions is better for performance and cost. This article explores the design, performance, and cost issues for a large chip and an MCM, focusing primarily on the on-chip and off-chip delays and the trade-offs between the two. It also shows performance trends for each approach, to help us understand future performance limits for microprocessors
Keywords
microprocessor chips; multichip modules; semiconductor technology; cost; delays; large chip; microprocessors; multichip module; performance; performance trends; semiconductor processes; Bandwidth; Copper; Costs; Delay effects; Electronics packaging; FETs; Frequency; Integrated circuit interconnections; Microprocessors; Temperature;
fLanguage
English
Journal_Title
Micro, IEEE
Publisher
ieee
ISSN
0272-1732
Type
jour
DOI
10.1109/40.710869
Filename
710869
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