• DocumentCode
    1422462
  • Title

    Area I/O´s potential for future processor systems

  • Author

    Hirt, Etienne ; Scheffler, Michael ; Wyss, Jean-Pierre

  • Author_Institution
    Electron. Lab., Fed. Inst. of Technol., Zurich, Switzerland
  • Volume
    18
  • Issue
    4
  • fYear
    1998
  • Firstpage
    42
  • Lastpage
    49
  • Abstract
    Bandwidth, latency, system speed, and, of course, the size of future microprocessor systems all highly depend on interconnection technologies. Interconnection will become the key performance bottleneck as semiconductor technology improvements continue to reduce feature size. In this article, we describe the use of on-chip area I/O for future microprocessor systems on the basis of a case study we made of an Intel Pentium system. Area I/O is simply a method of locating I/Os over the entire chip instead of just the periphery. We show that system designers can achieve significant performance gains with area I/O and size reductions at both the system and chip levels. We also explain how area I/O in conjunction with high-density interconnects leads to a new package and chip partitioning concept
  • Keywords
    integrated circuit interconnections; microprocessor chips; Intel Pentium; area I/O; feature size; high-density interconnects; interconnection technologies; microprocessor systems; Bandwidth; Bonding; Clocks; Delay; Integrated circuit interconnections; Lead; Microprocessors; Packaging; Substrates; Wire;
  • fLanguage
    English
  • Journal_Title
    Micro, IEEE
  • Publisher
    ieee
  • ISSN
    0272-1732
  • Type

    jour

  • DOI
    10.1109/40.710870
  • Filename
    710870