DocumentCode
1422462
Title
Area I/O´s potential for future processor systems
Author
Hirt, Etienne ; Scheffler, Michael ; Wyss, Jean-Pierre
Author_Institution
Electron. Lab., Fed. Inst. of Technol., Zurich, Switzerland
Volume
18
Issue
4
fYear
1998
Firstpage
42
Lastpage
49
Abstract
Bandwidth, latency, system speed, and, of course, the size of future microprocessor systems all highly depend on interconnection technologies. Interconnection will become the key performance bottleneck as semiconductor technology improvements continue to reduce feature size. In this article, we describe the use of on-chip area I/O for future microprocessor systems on the basis of a case study we made of an Intel Pentium system. Area I/O is simply a method of locating I/Os over the entire chip instead of just the periphery. We show that system designers can achieve significant performance gains with area I/O and size reductions at both the system and chip levels. We also explain how area I/O in conjunction with high-density interconnects leads to a new package and chip partitioning concept
Keywords
integrated circuit interconnections; microprocessor chips; Intel Pentium; area I/O; feature size; high-density interconnects; interconnection technologies; microprocessor systems; Bandwidth; Bonding; Clocks; Delay; Integrated circuit interconnections; Lead; Microprocessors; Packaging; Substrates; Wire;
fLanguage
English
Journal_Title
Micro, IEEE
Publisher
ieee
ISSN
0272-1732
Type
jour
DOI
10.1109/40.710870
Filename
710870
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