Title :
Electrical modeling and simulation challenges in chip-package codesign
Author :
Cangellaris, Andreas C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Abstract :
High-performance, multifunctional systems demand novel, often revolutionary, practices in functional-block integration and packaging. Independent chip, package, and board design will have to give way to a holistic approach
Keywords :
circuit CAD; digital simulation; semiconductor device models; semiconductor device packaging; chip-package codesign; functional-block integration; packaging; simulation; Circuit simulation; Clocks; Computational modeling; Computer simulation; Crosstalk; Delay effects; Integrated circuit interconnections; Microprocessors; Packaging; Power system interconnection;
Journal_Title :
Micro, IEEE
