DocumentCode
142250
Title
A CMOS biologically expansion/contraction motion sensor and its implementation on z-motion direction/velocity detection
Author
Cheng-Ta Chiang ; Setiarini, Asih
Author_Institution
Dept. of Electr. Eng., Nat. Chia Yi Univ., Chiayi, Taiwan
Volume
3
fYear
2014
fDate
26-28 April 2014
Firstpage
2004
Lastpage
2008
Abstract
In this paper, a CMOS biologically expansion/contraction motion sensor and its implementation on z-motion direction/velocity detection is newly proposed. The proposed method to calculate the z-motion velocity is based on the principle of biconvex lens geometry (BLG). The proposed chip is attractive due to the fact that analog processing circuits and light sensor are integrated robustly and compactly. Different to previous work, the proposed method can be real-time to calculate the velocity of z-axis of an object. The proposed chip consists of 80 pixels, and the sensor array is divided into eight parts in different axes. The chip area is 4×4 mm2. Based upon the device parameters of 0.35 μm 2P4M CMOS technology, all the functions and performance of the proposed expansion/contraction motion sensor and its implementation on z-motion direction/velocity detection are successfully tested and proven through SPICE simulations. The proposed chip is suitable for Z-motion applications, such as surveillance robot and 3D motion applications.
Keywords
CMOS analogue integrated circuits; CMOS image sensors; SPICE; geometry; lenses; motion measurement; optical sensors; sensor arrays; velocity measurement; 2P4M CMOS technology; BLG; CMOS biologically expansion-contraction motion sensor; SPICE simulations; analog processing circuits; biconvex lens geometry; light sensor; sensor array; size 0.35 mum; z-motion direction detection; z-motion velocity detection; Arrays; CMOS integrated circuits; Lenses; Retina; Robot sensing systems; Smoothing methods; BLG; Z-motion; expansion/contraction; image sensor; motion sensor;
fLanguage
English
Publisher
ieee
Conference_Titel
Information Science, Electronics and Electrical Engineering (ISEEE), 2014 International Conference on
Conference_Location
Sapporo
Print_ISBN
978-1-4799-3196-5
Type
conf
DOI
10.1109/InfoSEEE.2014.6946274
Filename
6946274
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