DocumentCode :
1423326
Title :
Interface trap generation by FN injection under dynamic oxide field stress
Author :
Chen, T.P. ; Li, Stella ; Fung, S. ; Lo, K.F.
Author_Institution :
Dept. of Phys., Hong Kong Univ., Hong Kong
Volume :
45
Issue :
9
fYear :
1998
fDate :
9/1/1998 12:00:00 AM
Firstpage :
1920
Lastpage :
1926
Abstract :
Interface trap generation under dynamic (bipolar and unipolar) and dc oxide field stress has been investigated with the charge pumping technique. It is observed that regardless of stress type, whether dc or dynamic (bipolar or unipolar), and the polarity of stress voltage, interface trap generation starts to occur at the voltage at which Fowler-Nordheim (FN) tunneling through the oxide starts to build up. For positive voltage, interface trap generation is attributed to the recombination of trapped holes with electrons and to the bond breaking by the hydrogen (H and H+) released during stressing. For negative voltage, in addition to these two mechanisms, the bond breaking by energetic electrons may also contribute to interface trap generation. The frequency dependence of interface trap generation is also investigated. Interface trap generation is independent of stressing frequency for unipolar stress but it shows a frequency dependence for bipolar stress
Keywords :
MOSFET; electron traps; electron-hole recombination; hole traps; interface states; tunnelling; FN injection; Fowler-Nordheim tunneling; MOSFET; bond breaking; charge pumping; dynamic oxide field stress; electron-hole recombination; hydrogen release; interface trap generation; Bonding; Charge carrier processes; Charge pumps; DC generators; Electron traps; Frequency dependence; Spontaneous emission; Stress; Tunneling; Voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.711356
Filename :
711356
Link To Document :
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