Title :
Low complexity multiview video plus depth coding
Author :
Zhang, Qiuwen ; An, Ping ; Zhang, Yan ; Shen, Liquan ; Zhang, Zhaoyang
Author_Institution :
Key Lab. of Minist. of Educ. for Adv. Display & Syst. Applic., Shanghai Univ., Shanghai, China
fDate :
11/1/2011 12:00:00 AM
Abstract :
Multiview video plus depth (MVD) is a new 3D video format that would support 3D applications developed by MPEG. Such a format is a combination of texture video and associated depth maps. Consequently, for the efficient transmission of 3D video signals, the compression of texture video and also the depth maps is required. Since high computational complexity of jointly coding between the texture video and depth map is still an open question, this paper introduces a low complexity MVD coding algorithm that adaptively utilizes the texture and depth map correlation. Based on the correlation, we propose four efficient techniques, including depth information based fast mode size decision, adaptive disparity estimation in texture coding, motion vector sharing based on the texture image similarity correlation and the SKIP mode decision in depth coding. Experimental results show that the proposed algorithm can significantly reduce the computational complexity of MVD coding while improve the coding performance and achieve better rendering quality1.
Keywords :
computational complexity; image motion analysis; image texture; video coding; 3D video format; 3D video signals; MPEG; SKIP mode decision; adaptive disparity estimation; computational complexity; depth information based fast mode size decision; depth map correlation; low complexity MVD coding algorithm; low complexity multiview video plus depth coding; motion vector sharing; texture coding; texture image similarity correlation; texture video; Complexity theory; Correlation; Encoding; Estimation; Three dimensional displays; Vectors; Video coding; 3D video coding; depth map coding.; multiview video plus depth(MVD); texture and depth map correlation;
Journal_Title :
Consumer Electronics, IEEE Transactions on
DOI :
10.1109/TCE.2011.6131164