Title :
Integration and Packaging of a Macrochip With Silicon Nanophotonic Links
Author :
Cunningham, John E. ; Krishnamoorthy, Ashok V. ; Ho, Ron ; Shubin, Ivan ; Thacker, Hiren ; Lexau, Jon ; Lee, Daniel C. ; Feng, Dazeng ; Chow, Eugene ; Luo, Ying ; Zheng, Xuezhe ; Li, Guoliang ; Yao, Jin ; Pinguet, Thierry ; Raj, Kannan ; Asghari, Mehdi ;
Author_Institution :
Oracle Labs., San Diego, CA, USA
Abstract :
The technologies associated with integration and packaging have a significant impact on the overall system. In this paper, we review a silicon photonic “macrochip” system and its associated packaging that will allow dense wavelength-division multiplexed optical links to be intimately integrated and co-manufactured with the switching electronics. For this to happen, we anticipate a number of integration and packaging advances.
Keywords :
electronics packaging; elemental semiconductors; integrated optics; nanophotonics; optical links; optical switches; silicon; wavelength division multiplexing; Si; dense wavelength-division multiplexed optical links; integrated optics; packaging; silicon photonic macrochip system; switching electronics; Arrays; Bridge circuits; Optical interconnections; Optical waveguides; Packaging; Silicon; Transistors; CMOS; computing; macrochip; nanophotonics; optical interconnects; routers; silicon photonics; switching; very large scale integration (VLSI);
Journal_Title :
Selected Topics in Quantum Electronics, IEEE Journal of
DOI :
10.1109/JSTQE.2010.2091674
