DocumentCode
1423981
Title
Micromachined Piezoresistive Accelerometers Based on an Asymmetrically Gapped Cantilever
Author
Li, Yuefa ; Zheng, Qinglong ; Hu, Yating ; Xu, Yong
Author_Institution
Dept. of Electr. & Comput. Eng., Wayne State Univ., Detroit, MI, USA
Volume
20
Issue
1
fYear
2011
Firstpage
83
Lastpage
94
Abstract
This paper reports the development of piezoresistive accelerometers based on an asymmetrically gapped cantilever which is composed of a bottom mechanical layer and a top piezoresistive layer separated by a gap. The asymmetrically gapped cantilever helps to increase the sensitivity and enables the majority of mechanical energy to be effectively used to strain the piezoresistive layer. An analytic model of the asymmetrically gapped cantilever was developed and verified using finite-element simulation. Design optimization was discussed based on the analytical model. A figure of merit was defined as the product of the signal-to-noise ratio and resonant frequency. It was demonstrated that the energy efficiency is a critical criterion of design optimization. The prototypes of the piezoresistive accelerometer were successfully fabricated using deep reactive-ion etching from both the front and back sides of silicon-on-insulator wafers. The fabricated devices were preliminarily characterized. A sensitivity of 0.36 mV/V/g and a fundamental resonant frequency of 4060 Hz were obtained. The noise of the fabricated device was also measured and analyzed.
Keywords
accelerometers; cantilevers; finite element analysis; micromachining; microsensors; optimisation; piezoresistive devices; silicon-on-insulator; sputter etching; asymmetrically gapped cantilever; design optimization; en¬ ergy efficiency; fabricated devices; finite element simulation; mechanical energy; mechanical layer; micromachined piezoresistive accelerometers; reactive-ion etching; resonant frequency; signal-to-noise ratio; silicon-on-insulator wafers; Asymmetrically gapped cantilever; micromachines; piezoresistive accelerometer;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2010.2100024
Filename
5685790
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