• DocumentCode
    1424062
  • Title

    Application of Micromachined Y -Cut-Quartz Bulk Acoustic Wave Resonator for Infrared Sensing

  • Author

    Pisani, Marcelo B. ; Ren, Kailiang ; Kao, Ping ; Tadigadapa, Srinivas

  • Author_Institution
    Dept. of Electr. Eng., Pennsylvania State Univ., University Park, PA, USA
  • Volume
    20
  • Issue
    1
  • fYear
    2011
  • Firstpage
    288
  • Lastpage
    296
  • Abstract
    This paper presents the design, fabrication, and characterization of thermal infrared (IR) imaging arrays operating at room temperature which are based on Y-cut-quartz bulk acoustic wave resonators. A novel method of tracking the resonance frequency based upon the measurement of impedance is presented. High-frequency (240-MHz) micromachined resonators from Y-cut-quartz crystal cuts were fabricated using heterogeneous integration techniques on a silicon wafer. A temperature sensitivity of 22.16 kHz/°C was experimentally measured. IR measurements on the resonator pixel resulted in a noise equivalent power of 3.90 nW/Hz1/2, a detectivity D* of 1 × 105 cm · Hz1/2/W, and a noise equivalent temperature difference of 4 mK in the 8- to 14-μm wavelength range. The thermal frequency response of the resonator was determined to be faster than 33 Hz, demonstrating its applicability in video-rate uncooled IR imaging. This work represents the first comprehensive thermal characterization of micromachined F-cut-quartz resonators and their IR sensing response.
  • Keywords
    frequency response; infrared imaging; resonators; acoustic wave resonator; frequency 240 MHz; micromachined resonator; resonance frequency; silicon wafer; temperature sensitivity; thermal frequency response; thermal infrared imaging; wavelength 8 mum to 14 mum; $Y$-cut quartz; Bulk acoustic wave resonator; heterogeneous microelectromechanical systems integration; infrared (IR) detector; quartz micromachining; thermal IR sensor;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2010.2100030
  • Filename
    5685833