DocumentCode :
1424594
Title :
Processing and reliability of fast-flow, snap-cure underfills - Part I: processing and moisture sensitivity
Author :
Baldwin, Daniel F. ; Houston, Paul N.
Author_Institution :
Georgia Institute of Technology
Volume :
23
Issue :
4
fYear :
2000
fDate :
10/1/2000 12:00:00 AM
Firstpage :
235
Lastpage :
235
Keywords :
Assembly; Components, packaging, and manufacturing technology; Cranes; Electronic packaging thermal management; Electronics packaging; Flip chip; Industrial electronics; Materials reliability; Moisture; Testing;
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2000.895055
Filename :
895055
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1424594
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