DocumentCode
1424620
Title
Burn-in effect on yield
Author
Taeho Kim ; Way Kuo ; Wei-Ting Kary Chien
Author_Institution
Korea Telecom
Volume
23
Issue
4
fYear
2000
fDate
10/1/2000 12:00:00 AM
Firstpage
236
Lastpage
236
Keywords
Manufacturing industries; Performance analysis; Semiconductor device manufacture; Semiconductor device reliability; Semiconductor devices; Shape; Substrates; Telecommunications;
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2000.895059
Filename
895059
Link To Document