DocumentCode :
1424712
Title :
Single-insertion temperature testing of semiconductor ICs
Author :
Pfahnl, Andreas C. ; Muller, Luis A. ; Cochran, Pat
Author_Institution :
Teradyne Inc., Bedford, MA, USA
Volume :
23
Issue :
4
fYear :
2000
fDate :
10/1/2000 12:00:00 AM
Firstpage :
284
Lastpage :
292
Abstract :
This paper presents a preliminary-design study considering the feasibility and conceptual implementation of single-insertion temperature testing of any type of semiconductor integrated circuit (IC): memory, microcontroller, microprocessor, or application specific IC. Analyses are presented that establish the necessary thermal response rate of a device under test to make single-insertion testing comparable in throughput performance to a conventional test method. Modeling with ideal conditions to obtain the fastest device response shows that single-insertion testing in testing plastic packaged parts (or slow responding devices) will only be applicable when the test parallelism is very high (>32) and lot overhead times are long (⩾1 h). Given that actual lot overhead times are generally less than 1 h and the trend is for decreasing lot overhead times, the test method is likely more applicable to testing die-exposed type devices, since the test parallelism can be much lower for a given lot overhead time
Keywords :
automatic test equipment; automatic testing; integrated circuit manufacture; integrated circuit testing; production testing; thermal management (packaging); thermal stresses; ASIC; automated test handler; die-exposed type devices; ideal conditions modelling; lot overhead times; memory IC; microcontroller; microprocessor; plastic packaged parts; semiconductor integrated circuit; single-insertion temperature testing; slow responding devices; test parallelism; thermal response rate; thermal stress; throughput performance; Application specific integrated circuits; Circuit testing; Integrated circuit testing; Microcontrollers; Microprocessors; Performance analysis; Plastics; Semiconductor device testing; Temperature; Throughput;
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/6104.895073
Filename :
895073
Link To Document :
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