A new release control policy (WRELM) for semiconductor wafer fabrication facilities

Author

Chen, Z.B. ; Pan, X.W. ; Li, Luoqing ; Chen, Q.J. ; Xu, W.S.

Author_Institution

Sch. of Electron. & Inf. Eng., Tongji Univ., Shanghai, China

fYear

2014

fDate

7-9 April 2014

Firstpage

64

Lastpage

68

Abstract

Release control plays an important role on the performance of a semiconductor wafer fabrication facility. Comparing to common release control strategies (such as FIFO, EDD, SA, CONWIP, WR, and WIPCTRL), a new workload regulating policy (abbreviated as WRELM), with a dynamic critical value on the bottleneck obtained by an extreme learning machine, is proposed. WRELM is validated and verified by a simulation model from a real 6 inch fab. The simulation results show that WRELM improves the throughput by 4.02% and decrease the mean cycle time by 15.40% comparing to those of common WR.

Keywords

control engineering computing; learning (artificial intelligence); production control; production engineering computing; production facilities; semiconductor industry; semiconductor technology; CONWIP strategy; EDD strategy; FIFO strategy; SA strategy; WIPCTRL strategy; WR strategy; WRELM policy; dynamic critical value; extreme learning machine; mean cycle time; release control policy; semiconductor wafer fabrication facilities; throughput; workload regulating policy; Films; Workstations; dynamic critical value; extreme learning machine; release control; semiconductor manufacturing; workload regulating;

fLanguage

English

Publisher

ieee

Conference_Titel

Networking, Sensing and Control (ICNSC), 2014 IEEE 11th International Conference on

Conference_Location

Miami, FL

Type

conf

DOI

10.1109/ICNSC.2014.6819601

Filename

6819601