• DocumentCode
    1425702
  • Title

    Quantum-mechanical modeling of electron tunneling current from the inversion layer of ultra-thin-oxide nMOSFET´s

  • Author

    Lo, S.H. ; Buchanan, D.A. ; Taur, Y. ; Wang, W.

  • Author_Institution
    IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
  • Volume
    18
  • Issue
    5
  • fYear
    1997
  • fDate
    5/1/1997 12:00:00 AM
  • Firstpage
    209
  • Lastpage
    211
  • Abstract
    Quantum-mechanical modeling of electron tunneling current from the quantized inversion layer of ultra-thin-oxide (<40 /spl Aring/) nMOSFET´s is presented, together with experimental verification. An accurate determination of the physical oxide thickness is achieved by fitting experimentally measured capacitance-versus-voltage curves to quantum-mechanically simulated capacitance-versus-voltage results. The lifetimes of quasibound states and the direct tunneling current are calculated using a transverse-resonant method. These results are used to project an oxide scaling limit of 20 /spl Aring/ before the chip standby power becomes excessive due to tunneling currents,.
  • Keywords
    MOSFET; capacitance; dielectric thin films; inversion layers; leakage currents; semiconductor device models; tunnelling; 20 to 40 A; capacitance-versus-voltage curves; direct tunneling current; electron tunneling current; n-channel MOSFET; oxide scaling limit projection; oxide thickness; quantized inversion layer; quantum-mechanical modeling; quantum-mechanically simulated C/V results; quasibound states lifetime; transverse-resonant method; ultra-thin-oxide nMOSFET; CMOS technology; Capacitance; Electromagnetic waveguides; Electrons; Equations; Leakage current; MOSFET circuits; Potential well; Surface treatment; Tunneling;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.568766
  • Filename
    568766