DocumentCode :
1426052
Title :
Making GaAs integrated circuits
Author :
Kirkpatrick, Conilee G.
Author_Institution :
Sci. Appl. Int. Corp., Thousand Oaks, CA, USA
Volume :
76
Issue :
7
fYear :
1988
fDate :
7/1/1988 12:00:00 AM
Firstpage :
792
Lastpage :
815
Abstract :
Digital gallium arsenide (GaAs) integrated circuits offer prospects for high-performance electronics, particularly for increased speed and radiation hardness. Prototype GaAs devices fabricated in technologies ranging from ion-implanted metal semiconductor field-effect transistors (MESFETs) and junction field-effect transistors (JFETs) to epitaxial heterostructures, such as high-electron-mobility transistors (HEMTs) and heterojunction bipolar transistors (HBTs), have demonstrated these advantages. While these GaAs technologies share many common fabrication features, the unique characteristics of each and GaAs materials present significant manufacturing challenges. It is argues that to produce real integrated circuits (ICs) for system applications, the disciplines and rigors of a production environment as well as the innovations of research and development are required
Keywords :
III-V semiconductors; digital integrated circuits; integrated circuit technology; monolithic integrated circuits; GaAs integrated circuits; digital ICs; epitaxial heterostructures; heterojunction bipolar transistors; high-electron-mobility transistors; ion-implanted metal semiconductor field-effect transistors; junction field-effect transistors; manufacturing challenges; production environment; radiation hardness; speed; Digital integrated circuits; FETs; Gallium arsenide; HEMTs; High speed integrated circuits; Integrated circuit technology; JFETs; MESFETs; MODFETs; Prototypes;
fLanguage :
English
Journal_Title :
Proceedings of the IEEE
Publisher :
ieee
ISSN :
0018-9219
Type :
jour
DOI :
10.1109/5.7144
Filename :
7144
Link To Document :
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