• DocumentCode
    1426731
  • Title

    High frequency properties of passive materials for ultrasonic transducers

  • Author

    Wang, Haifeng ; Ritter, Timothy A. ; Cao, Wenwu ; Shung, K. Kirk

  • Author_Institution
    Mater. Res. Lab., Pennsylvania State Univ., University Park, PA, USA
  • Volume
    48
  • Issue
    1
  • fYear
    2001
  • Firstpage
    78
  • Lastpage
    84
  • Abstract
    The acoustic properties of passive materials for ultrasonic transducers have been measured at room temperature in the frequency range from 25 to 65 MHz using ultrasonic spectroscopy. These materials include alumina/EPO-TEK 301 composites and tungsten/EPO-TEK 301 composites. Experimental results showed that the acoustic impedance of the composites monotonically increased with the volume fraction of the particle filler, which is in agreement with the Denavey model. The attenuation, however, peaked between 7 and 9% volume fraction of particle filler. For comparison, several other passive materials were also fabricated and measured. The results suggest that materials that possess a higher attenuation also appear to have a larger velocity dispersion.
  • Keywords
    acoustic impedance; composite materials; ultrasonic transducers; ultrasonic velocity; 25 to 65 MHz; Al/sub 2/O/sub 3/; Denavey model; HF properties; US transducers; W; W/EPO-TEK 301 composites; acoustic impedance; acoustic properties; alumina/EPO-TEK 301 composites; attenuation; high frequency properties; particle filler; passive materials; ultrasonic spectroscopy; velocity dispersion; Acoustic materials; Acoustic measurements; Attenuation; Composite materials; Frequency measurement; Spectroscopy; Temperature distribution; Temperature measurement; Ultrasonic transducers; Ultrasonic variables measurement; Aluminum Oxide; Epoxy Compounds; Lenses; Transducers; Tungsten; Ultrasonography;
  • fLanguage
    English
  • Journal_Title
    Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-3010
  • Type

    jour

  • DOI
    10.1109/58.895911
  • Filename
    895911