• DocumentCode
    1427298
  • Title

    Ultrasonic transmission and reception from bulk-micromachined transducers

  • Author

    Harris, Paul D. ; Andrews, Michacl E. ; Turner, Gary C.

  • Author_Institution
    New Zealand Inst. for Ind. Res., Lower Hutt, New Zealand
  • Volume
    48
  • Issue
    1
  • fYear
    2001
  • Firstpage
    224
  • Lastpage
    231
  • Abstract
    Acoustic transduction in air from two bulk-micromachined silicon structures is investigated. Both contain silicon diaphragms of the order of 2 mm/sup 2/ in close proximity to a metallized substrate. One diaphragm is mass-loaded; the other is not. Their resonant frequencies (70 and 360 kHz) are dominated by squeeze film trapping of ambient air, and the Q of each device is about 8. The lower frequency (LF) device is characterized by electrical and acoustic measurements using a calibrated microphone. Novel diagnostic methods that exploit the nonlinear nature of the transducer are described. The adequacy of calibration by reciprocity is confirmed at 70 kHz and applied to the high frequency device. An insertion loss of 19 dB is measured, which compares well with reports of other silicon-based transducers. Observed losses are accounted for by squeeze-film damping applied to the diaphragm-substrate gap. The ability to control the bandwidth by the squeeze film effect, good efficiency, and the relatively standard method of construction could make such ultrasonic transducers useful in specialist applications.
  • Keywords
    damping; diaphragms; elemental semiconductors; losses; micromachining; piezoelectric semiconductors; silicon; ultrasonic transducers; 19 dB; 360 kHz; 70 kHz; Si; acoustic transduction; bulk-micromachined transducers; calibrated microphone; diaphragm-substrate gap; diaphragms; insertion loss; reciprocity; resonant frequencies; squeeze film trapping; squeeze-film damping; ultrasonic transducers; Acoustic measurements; Acoustic transducers; Calibration; Insertion loss; Metallization; Microphones; Resonant frequency; Silicon; Substrates; Ultrasonic transducers;
  • fLanguage
    English
  • Journal_Title
    Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-3010
  • Type

    jour

  • DOI
    10.1109/58.896135
  • Filename
    896135