DocumentCode :
1428533
Title :
Power and Thermal Constrained Test Scheduling Under Deep Submicron Technologies
Author :
YAo, Chunhua ; Saluja, Kewal K. ; Ramanathan, Parameswaran
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Wisconsin, Madison, WI, USA
Volume :
30
Issue :
2
fYear :
2011
Firstpage :
317
Lastpage :
322
Abstract :
Conventional power constrained test scheduling methods do not guarantee a thermal-safe solution. In this paper, we propose a test scheduling algorithm that satisfies the resource, power, and thermal constraints. First, in contrast to existing schemes, the proposed algorithm exploits superposition principle to perform fast and accurate thermal simulation, which, in turn, allows the algorithm to search for solutions which introduce cooling periods between tests to reduce the overall test length. Second, we propose a test partition-based method to further improve the performance of the test scheduling. We apply our test scheduling algorithm to ITC´02 SoC benchmarks and the results show considerable improvement in the total test length over existing methods.
Keywords :
integrated circuit testing; scheduling; system-on-chip; ITC´02 SoC benchmarks; deep submicron technology; superposition principle; test partition-based method; thermal constrained test scheduling; thermal simulation; Benchmark testing; Computational modeling; Optimization; Power demand; Schedules; Scheduling algorithm; System-on-a-chip; Superposition; system-on-chip (SoC) test; test partition; test scheduling; thermal simulation;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.2010.2079350
Filename :
5689117
Link To Document :
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