DocumentCode :
1428786
Title :
Simulated annealing-based algorithms for the studies of the thermoelastic scaling behavior
Author :
Wong, Y.C. ; Leung, K.S. ; Wong, C.K.
Author_Institution :
Dept. of Comput. Sci. & Eng., Chinese Univ. of Hong Kong, Shatin, China
Volume :
30
Issue :
4
fYear :
2000
fDate :
11/1/2000 12:00:00 AM
Firstpage :
506
Lastpage :
516
Abstract :
Simulated annealing is a robust and easy-to-implement algorithm for material simulation. However, it consumes a huge amount of computational time, especially on the studies of percolation networks. To reduce the running time, we parallelize the simulated annealing algorithm in our studies of the thermoelastic scaling behavior of percolation networks. The critical properties of the thermoelastic moduli of percolation networks near the threshold pc are investigated by constructing a square percolation network. The properties are tested by simulations of a series of two-dimensional (2-D) percolation networks near pc. The simulations are performed using a novel parallelizing scheme on the simulated annealing algorithm. To further accelerate the computational speed, we also propose a new conjectural method to generate better initial configurations, which speeds up the simulation significantly. Preliminary simulation results show surprisingly that the percolating phenomenon of thermal expansion does exist under certain conditions. The behavior seems to be governed by the elastic properties of a percolation network
Keywords :
parallel algorithms; percolation; physics computing; simulated annealing; thermal expansion; thermoelasticity; computational speed; computational time; elastic properties; material simulation; parallel algorithm; simulated annealing; simulation; square percolation network; thermal expansion; thermoelastic scaling behavior; two-dimensional percolation networks; Acceleration; Computational modeling; Computer networks; Conducting materials; Dielectrics and electrical insulation; Lattices; Robustness; Simulated annealing; Stochastic processes; Thermoelasticity;
fLanguage :
English
Journal_Title :
Systems, Man, and Cybernetics, Part C: Applications and Reviews, IEEE Transactions on
Publisher :
ieee
ISSN :
1094-6977
Type :
jour
DOI :
10.1109/5326.897077
Filename :
897077
Link To Document :
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