• DocumentCode
    1428801
  • Title

    A new boundary element technique to transient non-linear low penetration problems of multiconductor systems

  • Author

    Yuferev, Sergei ; Kettunen, Lauri

  • Author_Institution
    Tampere Univ. of Technol., Finland
  • Volume
    34
  • Issue
    5
  • fYear
    1998
  • fDate
    9/1/1998 12:00:00 AM
  • Firstpage
    2613
  • Lastpage
    2616
  • Abstract
    This paper describes a time domain boundary element formulation for calculation of eddy currents in a system of conductors of magnetic material due to the passage of short current pulses. The perturbation method is applied to derive the implicit time domain non-linear surface impedance boundary condition (SIBC) for the normal component of the magnetic field (magnetic induction) on the surface of the conductor of homogeneous isotropic magnetic material with an arbitrary BH-curve. Then the SIBC is coupled with the surface integral equation for the scalar magnetic potential given by the boundary integral equation method. The formulation developed is applicable to 3-D problems as well as 2-D problems. It Is shown that no computational difficulties arise compared to solving the problem under the assumption that the field does not penetrate into the body (static problem). A numerical example is considered
  • Keywords
    boundary integral equations; boundary-elements methods; eddy currents; perturbation theory; skin effect; time-domain analysis; transient analysis; boundary integral equation method; eddy current; magnetic field; magnetic induction; magnetic material; multiconductor system; perturbation method; scalar magnetic potential; surface impedance boundary condition; surface integral equation; time domain boundary element technique; transient nonlinear skin effect; Boundary conditions; Conducting materials; Couplings; Eddy currents; Integral equations; Magnetic domains; Magnetic fields; Magnetic materials; Perturbation methods; Surface impedance;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.717604
  • Filename
    717604