DocumentCode
1429727
Title
Impact of Mechanical Strain on GIFBE in PD SOI p-MOSFETs as Indicated From NBTI Degradation
Author
Lo, Wen-Hung ; Chang, Ting-Chang ; Dai, Chih-Hao ; Chung, Wan-Lin ; Chen, Ching-En ; Ho, Szu-Han ; Cheng, Osbert ; Huang, Cheng Tung
Author_Institution
Dept. of Phys. & the Inst. of Electro-Opt. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Volume
33
Issue
3
fYear
2012
fDate
3/1/2012 12:00:00 AM
Firstpage
303
Lastpage
305
Abstract
This letter investigates the impact of mechanical strain on gate-induced floating-body effect in partially depleted silicon-on-insulator p-channel metal-oxide-semiconductor field-effect transistors. The strained FB device has less NBTI degradation than unstrained devices. This behavior can be attributed to the fact that more electron accumulation induced by strain effect reduces the electric oxide field significantly during NBTI stress. Analysis of the body current under source/drain grounded and floating operation indicates an increase in the anode electron injection and electron tunneling from conduction band which occur at the partial poly-Si gate and Si substrate, respectively. This phenomenon can be attributed to the bandgap narrowing which has been induced by the strain effect.
Keywords
MOSFET; conduction bands; energy gap; silicon-on-insulator; FB device; GIFBE; NBTI degradation; NBTI stress; PD SOI p-MOSFET; Si substrate; anode electron injection; bandgap narrowing; body current analysis; conduction band; electric oxide field; electron accumulation; electron tunneling; floating operation; gate-induced floating-body effect; mechanical strain effect; mechanical strain impact; n+ poly-Si gate; partially depleted silicon-on-insulator p-channel metal-oxide-semiconductor field-effect transistor; source-drain grounded operation; Degradation; Logic gates; MOSFET circuits; Silicon; Strain; Stress; Tunneling; Gate-induced floating-body effect (GIFBE); negative bias temperature instability (NBTI); silicon-on-insulator (SOI) MOSFETs; strained silicon;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2011.2177956
Filename
6138276
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