Title :
Package solution of indirectly-heated type thermoelectric power sensors for RF application
Author :
Wang, D.B. ; Liao, X.P.
Author_Institution :
Key Lab. of MEMS of the Minist. of Educ., Southeast Univ., Nanjing, China
Abstract :
An economical package solution of indirectly-heated type thermoelectric power sensors is proposed for RF application at X-band (8-12GHz). The measured results of output voltages show that they both have an excellent linearity before and after the package. The difference of the sensitivity at 10GHz is 0.02mV/mW. After the package, this power sensor will be conveniently embedded into the RF systems.
Keywords :
electric sensing devices; power semiconductor devices; radiofrequency measurement; thermoelectric devices; RF application; X-band; frequency 8 GHz to 12 GHz; indirectly-heated type thermoelectric power sensors;
Journal_Title :
Electronics Letters
DOI :
10.1049/el.2011.3178
